1. Electronic Design Automation Challenges in Three Dimensional Integrated Chips (3D ICs) Open Access Author: Falkenstern, Paul Title: Electronic Design Automation Challenges in Three Dimensional Integrated Chips (3D ICs) Graduate Program: Computer Science and Engineering Keywords: OpenAccessScan ChainsThree Dimensional Integrated Chips (3D ICs)FloorplanPower/Ground Network Synthesis File: Download falkenst_thesis.pdf Committee Members: Dr Yuan Xie, Thesis Advisor/Co-AdvisorYuan Xie, Thesis Advisor/Co-Advisor
