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Start Over Graduate Program Computer Science and Engineering Degree MS Year 2008 Keyword Three Dimensional Integrated Chips (3D ICs)

1. Electronic Design Automation Challenges in Three Dimensional Integrated Chips (3D ICs)

open_access

Open Access

Author:: Falkenstern, Paul
Title:: Electronic Design Automation Challenges in Three Dimensional Integrated Chips (3D ICs)
Graduate Program:: Computer Science and Engineering
Keywords:: OpenAccess
Scan Chains
Three Dimensional Integrated Chips (3D ICs)
Floorplan
Power/Ground Network Synthesis
File:: Download falkenst_thesis.pdf
Committee Members:: Dr Yuan Xie, Thesis Advisor/Co-Advisor
Yuan Xie, Thesis Advisor/Co-Advisor