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1. Electronic Design Automation Challenges in Three Dimensional Integrated Chips (3D ICs)

open_access

Open Access

Author:: Falkenstern, Paul
Title:: Electronic Design Automation Challenges in Three Dimensional Integrated Chips (3D ICs)
Graduate Program:: Computer Science and Engineering
Keywords:: OpenAccess
Scan Chains
Three Dimensional Integrated Chips (3D ICs)
Floorplan
Power/Ground Network Synthesis
File:: Download falkenst_thesis.pdf
Committee Members:: Dr Yuan Xie, Thesis Advisor/Co-Advisor
Yuan Xie, Thesis Advisor/Co-Advisor