Thermal Characterization of Modern Microsystem Technologies from Materials to Devices
Open Access
- Author:
- Song, Yiwen
- Graduate Program:
- Mechanical Engineering
- Degree:
- Doctor of Philosophy
- Document Type:
- Dissertation
- Date of Defense:
- May 29, 2024
- Committee Members:
- Md Haque, Major Field Member
Robert Kunz, Professor in Charge/Director of Graduate Studies
Susan Trolier-McKinstry, Dissertation Co-Advisor
Sukwon Choi, Chair & Co-Dissertation Advisr
Wooram Lee, Outside Unit & Field Member - Keywords:
- thermal characterization
TDTR
FDTR
thermal management
power electronics
wide bandgap
Ga2O3
AlN
aluminum nitride
scandium aluminum nitride
thermal transport
phonon scattering
thermal property
thermal conductivity - Abstract:
- Recent technological advancements, including fifth-generation (5G) mobile networks, electrified transportation systems, and artificial intelligence, are fundamentally improving human lifestyles. These modern technologies have been made possible by tremendous efforts in the research and development of functional materials. The ongoing drive for system-level improvements in size, weight, and power (SWaP) of modern electronics establishes the need for new materials with enhanced properties. However, even when a material demonstrates potential due to its superior properties, numerous obstacles must be overcome to meet the performance, reliability, and manufacturing requirements necessary for commercialization. As thermal challenges are becoming increasingly common and severe in emerging microsystems, electro-thermal co-design for material development becomes indispensable. In this dissertation, frequency-domain thermoreflectance (FDTR), time-domain thermoreflectance (TDTR), and steady-state thermoreflectance (SSTR) were used to study and understand the fundamental thermophysical properties of emerging material systems for power electronics (β-Ga2O3 and (AlxGa1-x)2O3) and microelectromechanical systems (AlN, Al1-xScxN, and Pb(ZrxTi1−x)O3). Device modeling was performed using the measured thermal properties to evaluate the cooling requirements and design thermal management solutions.