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Start Over Graduate Program Materials Science and Engineering Degree PHD Committee Member Howard W Pickering Keyword bta Keyword chemical mechanical polishing Keyword cmp

1. SOME CHEMICAL AND ELECTROCHEMICAL ASPECTS OF THE CHEMICAL MECHANICAL POLISHING OF COPPER

open_access
Open Access
Author:
Al-Hinai, Ashraf Talib
Title:
SOME CHEMICAL AND ELECTROCHEMICAL ASPECTS OF THE CHEMICAL MECHANICAL POLISHING OF COPPER
Graduate Program:
Materials Science and Engineering
Keywords:
hydrogen peroxide
bare metal
hydroxylamine
chemical mechanical polishing
cmp
bta
benzotriazole
copper
File:
Download ata107phd.pdf
Committee Members:
Barbara Shaw, Committee Member
Howard W Pickering, Committee Member
Kwadwo Osseo Asare, Committee Chair/Co-Chair
Tarasankar Debroy, Committee Member

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